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UHV Components
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Spectroscopy
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Thin film & UVH Technology
UHV Components
Thin film & UVH Technology
a. Thin Film Deposition Systems
i. Physical Vapor Deposition
1. Magnetron Sputtering
a. RF DC and Pulsed DC Magnetron sources
b. HiPIMS -High Impulse power magnetron Sputtering
c. Assisted Magnetron sputtering
2. Thermal & E-Beam Evaporation
3. Pulsed Laser Depostion (PLD)
4. Molecular Beam Epitaxy (MBE)
ii. Chemical Vapor Deposition
1. Atmospheric/Thermal CVD
2. LPCVD
3. PECVD
a. Inductively Coupled PECVD
4. MOCVD
5. VPE
iii. ALD: SVTA
b. UHV Components
i. Manipulators & Components
1. Multiple Axes (1-2-3-4-5-6) manipulators Ambient
2. Flow Cryo type cryogenic manipulators
3. Dry Closed loop cryogenic manipulators
4. Sample receiving stations
5. Radial Distribution Chambers
6. Sample holders
7. Transport boxes or vacuum suitcases
ii. Instruments
1. Dual Anode X-ray Source
2. Dual Anode Monochromatic X-ray source
3. Dual Anode UV source
4. Dual Anode Monochromatic Source
5. Ion source for sample cleaning
6. Ion Sources focussing type for depth profiling and Ion Spectroscopy studies (ISS)
7. Electron Source (For AES)
8. AES LEED
9. Flood Gun for charge neutralisation
10. Quartz Crystal Thickness monitors
iii. Deposition Sources
Effusion Cells
Ebeam evaporators
Sputter Sources
Thermal Evaporators
c. UHV Electronics
i. Power Supplies & Controllers
1. DC power supplies
2. Pulsed DC power Supplies
3. RF power supplies
4. High Impulse Power Magnetron Sources (HiPIMS)
ii. Other electronic components
d. Etching Systems
i. Physical Ion Etching – Ion Milling
ii. Chemical Etching
1. Reactive Ion Etching (RIE)
2. Inductively Coupled RIE (ICPRIE)
3. Deep RIE (DRIE)
UHV Components
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Contact Info
Incienta Technologie GmbH
Pommernstrasse 22
D-63110 Rodgau-Weiskirchen
GERMANY
Tel:
+49 (0) 6106 625 2970
Fax:
+49 (0) 6106 625 2971
Emal:
info@incienta.com